Highlights from IEDM 2025: 3D NAND is suddenly relevant again, interconnect metals beyond copper are emerging, 2D materials that could replace silicon, and more (SemiAnalysis)

SemiAnalysis:
Highlights from IEDM 2025: 3D NAND is suddenly relevant again, interconnect metals beyond copper are emerging, 2D materials that could replace silicon, and more  —  IEDM 2025 Round-Up  —  It's an odd time in the chipmaking industry.  On one hand, we are ramping into the biggest supercycle ever seen.