
Sources: SK Hynix plans to build an advanced chip packaging plant in Indiana, for stacking DRAM chips to make High Bandwidth Memory (HBM) chips for Nvidia GPUs (Financial Times)
Financial Times: Sources: SK Hynix plans to build an advanced chip packaging plant in Indiana, for stacking DRAM chips to make High Bandwidth Memory (HBM) chips for Nvidia GPUs — South Korean company’s memory chips will be packaged with Nvidia… Read More »Sources: SK Hynix plans to build an advanced chip packaging plant in Indiana, for stacking DRAM chips to make High Bandwidth Memory (HBM) chips for Nvidia GPUs (Financial Times)








